Teams at Tenstorrent Inc.

Define architecture and micro-architecture specs for memory and I/O chiplets, evaluate next-generation memory technologies, develop performance and power modeling infrastructure, and collaborate with SoC, verification, physical design, packaging, systems teams and external partners to enable high-throughput, low-latency memory architectures.

Lead hardware-software co-design to enable AI/HPC and agentic AI stacks on RISC-V CPUs. Integrate and optimize low-level kernel infrastructure, runtimes, distributed execution, memory systems, and developer tools, collaborating with architects, compiler engineers, and kernel developers to meet performance targets.

Design and deliver die-to-die chiplet PHY IP in advanced FinFET nodes: develop PLLs and AMS blocks, lead design verification and layout interactions, support tape-out and silicon bring-up, and collaborate across architecture, digital, verification, layout, and software teams to achieve production-quality silicon.