In this role as a Staff Mechanical Engineer – Technical Lead, you'll be at the forefront of designing next-generation optical pluggable modules. You'll collaborate within a dynamic team of skilled engineers, fostering an innovative environment where your expertise shapes breakthrough solutions. Your work will involve hands-on engineering, from simulations to prototyping, ensuring products meet industry standards. You'll enjoy a supportive culture that emphasizes professional growth and knowledge sharing. Benefits include a competitive salary, flexible work arrangements, health and wellness programs, and opportunities for continuous learning. Join us to make a meaningful impact on global connectivity while being supported by a collaborative and forward-thinking team.
Design and develop mechanical components for optical pluggable modules, focusing on thermal, structural, and manufacturability aspects.
- Perform and supervise thermal simulations and finite element analysis (FEA) to optimize designs.
- Collaborate with system integration teams to create innovative die interconnect solutions exceeding 140GHz bandwidth.
- Create and review CAD models and detailed engineering drawings for precision manufacturing.
- Conduct tolerance and stress analyses, along with thermal design validation testing (DVT).
- Develop prototypes and facilitate the transition from design to production, minimizing redesign efforts.
- Engage with suppliers and contract manufacturers to troubleshoot mechanical and integration challenges.
Author and review engineering change orders (ECOs), bill of materials (BOMs), and technical documentation.
QualificationsMust-Have:
- Bachelor’s or Master’s degree in Mechanical Engineering
- 10+ years of experience in mechanical design, particularly with optical or telecom hardware
- Strong expertise in thermal design, FEA, and CAD modeling (Creo preferred)
- Proficiency in conducting die stress/strain simulations
- Excellent communication and leadership skills
Nice-To-Have:
- Experience with optical transceiver packaging (e.g., QSFP, OSFP)
- Knowledge of compliance and shock/vibration testing for telecom applications
- Familiarity with advanced substrate technologies like LTCC and HTCC
- Experience in new product introduction (NPI) processes
.png)
.png)
